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32014nk/71112sy/30712sy 20120203-s00001 no.a2017-1/14 semiconductor components industries, llc, 2014 march, 2014 http://onsemi.com ordering information see detailed ordering and shipping informa tion on page 14 of this data sheet. LV5694P overview the LV5694P is a multiple output linear regulator ic, whic h allows reduction of quiescent current. the LV5694P is specifically designed to address automotive infotainment sy stems power supply requirements. the LV5694P integrates 5 linear regulator outputs, 2 high side power switches, over current protection, overvoltage protection and thermal shutdown circuitry. function ? low consumption current: 50a (typ, only v dd output is in operation) ? 5 systems of regulator output v dd for microcontroller: output voltage: 5.0v/3.3v (always on), maximum output current: 300ma for swd5v: output voltage: 5v, maximum output current: 500ma for cd: output voltage: 7.6v/8.1v, maximum output current: 2000ma for illumination: output voltage: 9.0v, maximum output current: 500ma for audio: output voltage: 8.45v, maximum output current: 800ma ? 2 lines of high side switch with interlock v cc amp: maximum output current: 500ma, voltage difference between input and output: 0.5v ant: maximum output current: 350ma, voltage difference between input and output: 0.5v ? overcurrent protector ? overvoltage protector: typ 36v (all outputs are turned off) ? overheat protector: typ 175c ? pchldmos is used in power output block (warning) the protector functions only improve the ic?s tole rance and they do not guarantee the safety of the ic if used under the conditions out of safety range or ratings. use of the ic such as use under over current protection range or thermal shutdown st ate may degrade the ic?s reliability and eventually damage the ic. orderin g numbe r : ena2017b bi-cmos ic system power supply ic for automotive infotainment multiple output linear voltage regulator hzip15j
LV5694P no.a2017-2/14 specifications absolute maximum ratings at ta = 25 c parameter symbol conditions ratings unit power supply voltage v cc max 36 v power dissipation pd max ic unit ta 25 c 1.5 w at using al heat sink 5.6 w at infinity heat sink 32.5 w peak voltage v cc peak regarding bias wave, refe r to below the pulse. 50 v junction temperature tj max 150 c operating temperature topr -40 to +85 c storage temperature tstg -55 to +150 c recommended operating conditions at ta = 25 c parameter conditions ratings unit power supply voltage rating 1 v dd output, swd output 7 to 16 v power supply voltage rating 2 ilm output 10.8 to 16 v power supply voltage rating 3 audio output, cd output 10 to 16 v power supply voltage rating 4 ant output, amp output 7.5 to 16 v * v cc 1 should be as follows: v cc 1>v cc -0.7v electrical characteristics at ta = 25c, v cc = v cc 1=14.4v (*2) parameter symbol conditions ratings unit min typ max v cc 1 input voltage v cc 1 v cc -0.7 v 16 v current drain i cc v dd no load, ctrl1/2/3 = ? l/l/l ? 50 100 a ctrl1/2/3 input low input voltage v il 1 - - 0.3 v middle1 input voltage v im 1 0.9 1.18 1.45 v middle2 input voltage v im 2 1.85 2.10 2.4 v high input voltage v ih 1 2.95 3.29 5.5 v input impedance r ih 1 input voltage 3.3v 280 400 520 k ikcd/ikv dd input low input voltage v il 2 - - 0.7 v high input voltage v ih 2 ikcd ikv dd v cc -0.7v v cc 1-0.7 v - - v v dd output (5v/3.3v) output voltage v o 11 i o 1 = 200ma, ikv dd =v cc 1 4.75 5.0 5.25 v v o 12 i o 1 = 200ma, ikv dd =gnd 3.16 3.3 3.45 v output current i o 1 v o 11 4.70v, v o 12 3.10v 300 ma line regulation v oln 1 7.5v < v cc 1 < 16v, i o 1 = 200ma 30 70 mv load regulation v old 1 1ma < i o 1 < 200ma 70 150 mv dropout voltage 1 v drop 1 i o 1 = 200ma (v dd output 5v) 0.8 1.6 v dropout voltage 2 v drop 1 ? i o 1 = 100ma (v dd output 5v) 0.4 0.8 v ripple rejection r rej 1 f = 120hz, i o 1 = 200ma 30 40 db short circuit current i s 1 v o 11, v o 12 = 0 50 150 340 ma continued on next page. stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should n ot be assumed, damage may occur and reliability may be affected. functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresses beyond the recomme nded operating ranges limits may affect device r eliab ility.
LV5694P no.a2017-3/14 continued from preceding page. parameter symbol conditions ratings unit min typ max audio (8.45v) output ; ctrl2 = ? m1 or h ? output voltage v o 3 i o 3 = 650ma 8.16 8.45 8.7 v output current i o 3 v o 3 8.0v 800 ma line regulation v oln 3 10v < v cc < 16v, i o 3 = 650ma 30 90 mv load regulation v old 3 1ma < i o 3 < 650ma 100 200 mv dropout voltage 1 v drop 3 i o 3 = 650ma 0.7 1.2 v dropout voltage 2 v drop 3 ? i o 3 = 200ma 0.2 0.35 v ripple rejection r rej 3 f = 120hz, i o 3 = 650ma 40 50 db short circuit current i s 3 v o 3 = 0 120 250 550 ma ilm (9v) output ; ctrl1 = ? m1 or h ? output voltage v o 4 i o 4 = 350ma 8.7 9.0 9.3 v output current i o 4 v o 4 8.6v 500 ma line regulation v oln 4 10.8v < v cc < 16v, i o 4 = 350ma 40 100 mv load regulation v old 4 1ma < i o 4 < 350ma 70 150 mv dropout voltage 1 v drop 4 i o 4 = 350ma 1.0 1.5 v dropout voltage 2 v drop 4 ? i o 4 = 200ma 0.3 0.6 v ripple rejection r rej 4 f = 120hz, i o 4 = 350ma 40 50 db short circuit current i s 4 v o 4 = 0 100 200 400 ma amp_hs-sw; ctrl3 = ? m2 or h ? output voltage v o 5 i o 5 = 500ma v cc -0.5 v cc -1.0 v output current i o 5 v o 5 v cc -1.0v 500 ma short circuit current i s 5 v o 5 = 0 120 250 500 ma ant_hs-sw; ctrl3 = ? m1 or h ? output voltage v o 6 i o 6 = 500ma v cc -0.5 v cc -1.0 v output current i o 6 v o 6 v cc -1.0v 350 ma short circuit current i s 6 v o 6 = 0 100 200 450 ma swd5v; ctrl2 = ? m2 or h ? output voltage v o 7 i o 7 = 350ma 4.75 5.0 5.25 v output current i o 7 v o 7 4.7v 500 ma line regulation v oln 7 10v < v cc < 16v, i o 7 = 350ma 30 70 mv load regulation v old 7 1ma < i o 7 < 350ma 70 150 mv dropout voltage v drop 7 i o 7 = 350ma 0.8 1.6 v ripple rejection r rej 7 f = 120hz, i o 7 = 350ma 40 50 db short circuit current i s 7 v o 7 = 0 100 200 450 ma cd(7.6/8.1v output); ctrl1 = ? m2 or h ? output voltage v o 81 i o 8 = 1300ma, ikcd=gnd 7.2 7.6 8.0 v v o 82 i o 8 = 1300ma, ikcd=v cc 7.7 8.1 8.5 v output current i o 8 v o 81 7.1v, v o 82 7.5v 2000 ma line regulation v oln 8 10.5v < v cc < 16v, i o 8 = 1300ma 40 100 mv load regulation v old 8 10ma < i o 8 < 1300ma 70 200 mv dropout voltage 1 v drop 8 i o 8 = 1300ma 1.3 1.5 v dropout voltage 2 v drop 8 ? i o 8 = 350ma 0.35 0.7 v ripple rejection r rej 8 f = 120hz, i o 8 = 1300ma 40 50 db short circuit current i s 8 v o 81 = 0, v o 82 = 0 300 550 1000 ma over voltage detection over voltage detection voltage v ovp v cc , all output stop 34 36 38 v *2: the entire specification has been defined based on th e tests performed under the conditions where tj and ta (=25 c) are almost equal. there tests were performed with pulse load to minimize t he increase of junction temperature (tj). product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product per formance may not be indicated by the electrical characteristics if operated under different conditions.
LV5694P no.a2017-4/14 package dimensions unit : mm hzip15j case 945ac issue a xxxxxxxxxx ymddd xxxxx = specific device code y = year m = month ddd = additional traceability data generic marking diagram* soldering footprint* note: the measurements are not to guarantee but for reference only. through hole area package name hzip15j (unit: mm) *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1.2 2.54 2.54 2.54 (1.91) 2.54
LV5694P no.a2017-5/14 ? allowable power dissipation derating curve ? waveform applied during surge test 100msec 5msec 16v 50v 10% 90% 0 7 2 1 1.5 4 3 5 5.6 6 8 0 20 140 150 80 100 60 120 40 160 aluminum heat sink (50 50 1.5mm 3 ) when using pd max -- ta ambient temperature, ta -- c allowable power dissipation, pd max -- w independent ic aluminum heat sink mounting conditions tightening torque : 39n ? cm, using silicone grease
LV5694P no.a2017-6/14 ctrl pin output truth table (each output is controll able by 4-value input) inamp inant ctrl3 amp ant l l l off off l h m1 off on h l m2 on off h h h on on ctrl2 swd5v audio ctrl1 cd ilm l off off l off off m1 off on m1 off on m2 on off m2 on off h on on h on on (warning) usage of ctrl pin when ctrl pin transits between l and m2, since it passes m1, ilm/audio/ant is turned on for a moment. likewise, when ctrl pin transits between h and m1, since it pa sses m2, ilm/audio/ant is turned off for a moment. to avoid operation failure by the a bove factors, please refer to (1) and (2) as shown below for precaution. ? do not connect parasitic capacitor to ctrl as much as possible. ? if use of capacitor for ctrl is required, k eep the resistance value as low as possible. (recommendation level: 2.2k / 3.9k ) ? make sure that the output load capacitor has enough marjin against the voltage fluctuation due to instantaneous on/off. (1) the time until a reaction occurs in outpu t after shifting from ctrl on to off (typ) off on time 27 c ctrl1 ilm 0.95 s ctrl2 audio 1.33 s ctrl3 ant 2.86 s due to quality fluctuation of the ics in manufacturing proc ess, the above-mentioned time can be shortened by 10 to 20%. (2) the time until output starts to react after shifting from ctrl on off control (typ): all output: 200ns to 300ns inamp inant ctrl3 microcontroller
LV5694P no.a2017-7/14 z block diagram + - amp out + - + - thermal shut down output control 300ma v cc gnd start up vref over voltage protection ctrl1 ctrl2 ctrl3 amp-sw(v cc -0.5v) 500ma 500ma 800ma + - + - 2000ma v cc ant out ant-sw(v cc -0.5v) 350ma 500ma ilm output (9v) audio output (8.45v) swd output (5v) cd output (7.6/8.1v) v cc 1(v dd supply input) v dd output (3.3/5v) ikv dd :v dd (3.3/5.0v)change pin ikv dd =v cc 1:5.0v ikv dd =gnd:3.3v ikcd:cd(7.6/8.1v)change pin ikcd=v cc :8.1v ikcd=gnd:7.6v
LV5694P no.a2017-8/14 pin function pin no. pin name description equivalent circuit 1 ilm ilm output pin on when ctrl1 = m1, h 9v/0.5a 15 2 v cc gnd 1 2 gnd gnd pin 3 cd cd output pin on when ctrl1 = m2, h 8.1v/2a (ikcd=v cc ) 7.6v/2a (ikcd=gnd) 15 2 v cc gnd 3 4 6 8 ctrl1 ctrl2 ctrl3 ctrl1/2/3 input pin four value input v cc 15 2 gnd 6 4 8 5 audio audio output pin on when ctrl2 = m1, h 8.45v/0.8a 15 2 v cc gnd 5 7 swd swd output pin on when ctrl2 = m2, h 5v/0.5a 15 2 v cc gnd 7 continued on next page.
LV5694P no.a2017-9/14 continued from preceding page. pin no. pin name description equivalent circuit 9 ant ant output pin on when ctrl3 = m1, h v cc -0.5v/350ma 15 2 v cc gnd 9 10 ikcd cd voltage control input pin 15 2 v cc gnd 10 11 amp amp output pin on when ctrl2 = m2, h v cc -0.5v/500ma 15 2 v cc gnd 11 12 ikv dd v dd voltage control input pin v cc 1/gnd 15 2 v cc gnd 12 5v 13 v dd v dd output pin 5.0v/0.3a (ikv dd = v cc 1) 3.3v/0.3a (ikv dd = gnd) 15 2 v cc gnd 13 14 v cc 1 v dd power supply pin 2 v cc 1 gnd 15 14 v cc 15 v cc power supply pin
LV5694P no.a2017-10/14 timing chart 36v v cc (15pin) v cc 1 (14pin) 36v 5.8v l m1 h l m2 h m1 m2 m1 m2 l h v dd output (5v) (13pin) ctrl1 input (4pin) ctrl2 input (6pin) ctrl3 input (8pin) ilm output (1pin) cd output (3pin) audio output (5pin) swd output (7pin) ant output (9pin) amp output (11pin) *the above values are obtained when typ.
LV5694P no.a2017-11/14 applied circuit example peripheral parts list name of part description recommended value remarks c2, c4, c6, c8, c12 output stabilization capacitor 10 f or more* electrolytic capacitor c1, c3, c5, c7, c11 output stabilization capacitor 0.22 f or more* ceramic capacitor c14, c16 power supply bypass capacitor 100 f or more these capacitors must be placed near the v cc and gnd pins. c13, c15 oscillation prevention capacitor 0.22 f or more c9, c10 amp/ant output stabilization capacitor 2.2 f or more r1, r2 resistance for protection 10 to 100k d1 diode for prevention of backflow m eeting the specifications of the rush electric current in a true use state d2, d3, d4, d5 diode for internal element protection sb1003m3 d6 diode for internal element protection sb1003m3 when a minus number surge is applied * : make sure that the capacitors of the output pins are 10 f or higher and meets the condition of esr is 0.001 to 10 ? (ceramic capacitor alone can be used.), in which voltage/ temperature fluctuation and unit differences are taken into consideration. more over, rf characteristics of el ectrolytic capacitor should be sufficient. + 14 12 10 8 ctrl1 6 ctrl2 4 swd 2 15 13 11 9 7 5 3 1 amp gnd v cc audio cd ilm + c8 c7 ilm + cd ctrl2 ctrl3 d1 c4 c3 d5 d2 c10 amp + audio c1 c2 swd ctrl3 ant ikcd ikv dd v dd v cc 1 ctrl1 + c6 c5 v cc + + + v dd c12 c11 c13 c14 c15 c16 + d3 c9 ant d4 r1 r2 d6
LV5694P no.a0000-12/14 caution for implementing LV5694P to a system board the package of LV5694P is hzip15j which has some metal exposure s other than connection pins an d heatsink as shown in the diagram below. the electrical potentials of (2) and (3) are the same as those of pin 15 and pin 1, respectively. (2) (=pin 15) is the v cc pin and (3) (=pin 1) is the ilm (regulator) output pin. when you implement the ic to the set board, make sure that the bolts an d the heatsink are out of touch from (2) and (3). if the metal exposur es touch the bolts which has th e same electrical potential with gnd, gnd short occurs in ilm output and v cc . the exposures of (1) are connected to heatsi nk which has the same el ectrical potential with substrate of the ic chip (gnd). therefore, (1) and gnd el ectrical potential of the set board can connect each other. ? hzip15j outline ? frame diagram (LV5694P) *in the system power suppl y other than LV5694P, pin assignment may differ. 1 2 3 1 1 heat-sink same potential 15pin same potential 1pin same potential heat-sink same potential heat-sink side :metal exposure heat-sink side heat-sink same potential :metal exposure 1pin 15pin metal exposure 1 metal exposure 3 metal exposure 2 metal exposure 1 metal exposure 1 metal exposure 1 lv5694
LV5694P no.a0000-13/14 hzip15j heat sink attachment heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. unless otherwise specified, for power ics with tabs and pow er ics with attached heat sinks, solder must not be applied to the heat sink or tabs. b. heat sink attachment use flat-head screws to attach heat sinks. use also washer to protect the package. use tightening torques in the ranges 39-59ncm(4-6kgcm) . if tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. take care a position of via hole . do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. verify that there are no press burrs or screw-hole burrs on the heat sink. warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for e ither concave or co nvex warping. twisting must be limited to under 0.05 mm. heat sink and semiconductor device are mounted in parallel. take care of electric or compressed air drivers the speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. c. silicone grease spread the silicone grease evenly when mounting heat sinks. our company recommends yg-6260 (mom entive performance materials japan llc) d. mount first mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. when attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. when mounting the semiconductor device to the heat sink using jigs, etc., take care not to allow the device to ride onto the jig or positioning dowel. design the jig so that no unreason able mechanical stress is not applied to the semiconductor device. f. heat sink screw holes be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. when using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. a hole diameter about 15% larger than the diameter of the screw is desirable. when tap screws are used, be sure that the diameter of th e holes in the heat sink are not too small. a diameter about 15% smaller than the diameter of the screw is desirable. g. there is a method to mount the semiconductor device to the heat sink by using a spring band. but this method is not recommended because of possible displacement due to fluc tuation of the spring force with time or vibration. binding head machine screw countersunk head mashine screw heat sink gap via hole
LV5694P ps no.a2017-14/14 ordering information device package shipping (qty / packing) LV5694P-e hzip15j (pb-free) 20 / fan-fold on semiconductor and the on logo are registered trademarks of semiconductor components industries, llc (scillc). scillc owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. a listing of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent-marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc mak es no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liab ility arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequentia l or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s techn ical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use a s components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other applica tion in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for an y such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and dis tributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of persona linjuryor death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture o fthe part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale i n any manner.

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